BLANCO, Claudio José Cavalcante, Ph.D.2025-03-132012https://rigalileo.itegam.org.br/handle/123456789/646This work is primarily providing knowledge about the real need to use the process corner glue in the corners of the components Ball Grid Array (BGA). The process is commonly used in notebook boards to provide mechanical resistance of solder joints, which can be affected during the process of SMT assembly, manual assembly, testing, ICT and functional testing and even use as a final product. Based on theoretical knowledge of the structures of components BGAs is intended what are the critical points that must be treated in the manufacturing process to ensure that the variables of assembly and testing will not harm the structures of the solder joints. Providing through bending tests, dye and pry analysis and electron microscopy, conclusive data on the strength of the epoxy glue used in the process corner glue. Providing manufacturing companies conditions of knowledge and decision on the need for deployment, continuity or even eliminating the process of applying glue to the corner boards mounted notebook technology with tin lead solder (with lead soldering).Corner Glue para BGAsComponentes BGAs no SMTSolda com chumboFlexão de placas de circuito impressoResistência mecânica de juntas de soldapdf.Engenharia Elétrica, Engenharia de Materiais e Metalúrgica Engenharia de Produção