FUJIYAMA, Roberto Tetsuo2025-03-132014https://rigalileo.itegam.org.br/handle/123456789/570In recent years, companies have invested in technological improvements to add lightweight, reduced size, and high performance to products, aiming to meet global demand. This dissertation aims to conduct a study on the quality and reliability of the Reflow soldering process of BGA (Ball Grid Array) technology components in the manufacturing of notebook boards. Using qualitative and quantitative methods, tests such as Cross Section and Dye and Pry were conducted to evaluate the soldering quality. The results showed that the Reflow soldering process meets the acceptability criteria of international standards, indicating that the process quality can reflect better cost conditions and competitiveness for the investigated organization.Soldagem ReflowComponente BGACross SectionDye and PryControle de Qualidadepdf.Engenharia de Produção; Engenharia Mecânica; Engenharia de Materiais e Metalúrgica