BRAGA, Eduardo de Magalhães2025-03-242021CAMARGO, Marco Antônio de Almeida. Redução do custo de pasta de solda no processo de tecnologia de montagem superficial (SMT). 2021. Dissertação (Mestrado Profissional em Engenharia de Processos) – Universidade Federal do Pará, Instituto de Tecnologia, Programa de Pós-Graduação em Engenharia de Processos, Belém, 2021.https://rigalileo.itegam.org.br/handle/123456789/847The Surface Mounting Technology (SMT) industries have faced constant challenges regarding environmental issues and cost reduction. The welding of electronic components traditionally incorporates lead, which presents environmental and financial risks due to the high cost of solder paste. The objective of this dissertation is to present the development of the local solder paste manufacturing process to reduce production costs while maintaining the quality and reliability of the product, especially in television electronic boards. The study includes a literature review on the SMT process and a case study in a factory located in the Manaus Industrial Pole (PIM). The results show that adopting local suppliers can generate significant savings by minimizing costs related to importation and logistics.pdf.SMTPasta de soldaRedução de custosEngenharia de ProcessosProdução eletrônicaDissertação de MestradoEngenharia Elétrica