FUJIYAMA, Roberto Tetsuo2025-03-072014https://rigalileo.itegam.org.br/handle/123456789/522Derived from broader studies on improvements in electrical and electronic manufacturing processes and computer goods, this research aims to technically evaluate the quality of weldability of the HDMI connector in the soldering process of Printed Circuit Boards (PCB) of notebooks, aiming to meet international acceptability criteria related to solder keg filling for Pin Through-Hole (PTH) component terminals as specified in the IPC-A-610D standard. For the development of the research steps, the Plan, Do, Check, and Action (PDCA) method was adopted. The results obtained through X-ray analysis and metallographic cross-section testing demonstrated that the quality of the HDMI component soldering through the reflow process, instead of the manual soldering process (hand soldering), meets the international IPC-A-610D standard, ensuring product reliability. Based on the results achieved, the company under study stopped performing manual soldering for this type of component in all notebook products, switching to soldering through SMT technology using the Pin in Paste (PIP) and Reflow soldering processes.Soldagem ReflowPDCAIPC-A-610DRaio-XPin in PastePDF.Engenharias; Engenharia de Produção; Engenharia Elétrica