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Proposed checklist for the implementation of the SMT component assembly process
(Instituto de Tecnologia e Educação Galileo da Amazônia, 2024) CRUZ JUNIOR, Davi Clementino da; VIEIRA JUNIOR, Milton
The manufacture of electronic products has evolved significantly over time, starting with wire assembly, through THT (Through Hole Technology), and reaching SMT (Surface Mount Technology), following the trend towards the miniaturization of electronic components. The complete SMT production process generally consists of three distinct stages: solder paste application, component positioning, and solder reflow to electrically connect the components to the board. The manufacture of electronic boards using surface mount technology is the most up-to-date, especially with the advent of Industry 4.0, which is increasingly raising the level of investment required to purchase the equipment/machines that make up a fully automated assembly line. However, it is common to find inefficient SMT lines, increasing manufacturing costs. This paper aims to present an efficient implementation system, considering everything from Design for Manufacturing (DFM) to Start Up, including technical information on the board and the components to be inserted into it, through the programming of assembly equipment.