Navegando por Autor "OLIVEIRA, Haroldo Melo de"

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    Avaliação do Processo Corner Glue para Componentes Eletrônicos BGAs em Placas de Notebook
    (Universidade Federal do Pará, 2012) OLIVEIRA, Haroldo Melo de; BLANCO, Claudio José Cavalcante, Ph.D.
    This work is primarily providing knowledge about the real need to use the process corner glue in the corners of the components Ball Grid Array (BGA). The process is commonly used in notebook boards to provide mechanical resistance of solder joints, which can be affected during the process of SMT assembly, manual assembly, testing, ICT and functional testing and even use as a final product. Based on theoretical knowledge of the structures of components BGAs is intended what are the critical points that must be treated in the manufacturing process to ensure that the variables of assembly and testing will not harm the structures of the solder joints. Providing through bending tests, dye and pry analysis and electron microscopy, conclusive data on the strength of the epoxy glue used in the process corner glue. Providing manufacturing companies conditions of knowledge and decision on the need for deployment, continuity or even eliminating the process of applying glue to the corner boards mounted notebook technology with tin lead solder (with lead soldering).
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    Estratégias para logística de suprimento de KITs de produtos de informática em uma empresa do Pólo Industrial de Manaus - PIM
    (INSTITUTO DE TECNOLOGIA, 2010) FREITAS, Carlos Alberto Oliveira de; OLIVEIRA, Edson Farias de; OLIVEIRA, Haroldo Melo de; SOUZA, João Carlos Rodrigues de; MAGALHÃES, Edilson Marques
    The article examines logistics strategies for supplying IT product kits in the Manaus Industrial Hub (PIM), focusing on transport modal choices (maritime, multimodal, and air) amid regional challenges and the 2008 financial crisis. The studied company initially adopted multimodal transport (Sea/Air) but switched to air freight due to customs delays and material shortages, ensuring speed despite higher costs. The study evaluates service dimensions (speed, consistency, capability, availability, and frequency) and underscores the role of logistics planning in maintaining PIM’s competitiveness.