Documentação de convênios

URI permanente desta comunidadehttps://rigalileo.itegam.org.br/handle/123456789/173

Trabalhos ténico-científico oriundos de convênios com universidades para oferta de turmas de mestrado e doutorados no Estado do Amazonas

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20211

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Autor: search.filters.author.CAMARGO, Marco Antônio de AlmeidaAssunto: search.filters.subject.Engenharia Elétrica

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    REDUÇÃO DO CUSTO DE PASTA DE SOLDA NO PROCESSO DE TECNOLOGIA DE MONTAGEM SUPERFICIAL (SMT)
    (Instituto de Tecnologia, 2021) CAMARGO, Marco Antônio de Almeida; BRAGA, Eduardo de Magalhães
    The Surface Mounting Technology (SMT) industries have faced constant challenges regarding environmental issues and cost reduction. The welding of electronic components traditionally incorporates lead, which presents environmental and financial risks due to the high cost of solder paste. The objective of this dissertation is to present the development of the local solder paste manufacturing process to reduce production costs while maintaining the quality and reliability of the product, especially in television electronic boards. The study includes a literature review on the SMT process and a case study in a factory located in the Manaus Industrial Pole (PIM). The results show that adopting local suppliers can generate significant savings by minimizing costs related to importation and logistics.