Documentação de convênios

URI permanente desta comunidadehttps://rigalileo.itegam.org.br/handle/123456789/173

Trabalhos ténico-científico oriundos de convênios com universidades para oferta de turmas de mestrado e doutorados no Estado do Amazonas

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    Análise do Processo de Montagem de Placas de Circuito Impresso de Notebook em uma Empresa do Polo Industrial de Manaus
    (Instituto de Tecnologia, 2017) MELO, Carlen Rodrigues de Castro; QUARESMA, João Nazareno Nonato
    This study examines the assembly process of printed circuit boards for notebooks in a company located in the Manaus Industrial Hub, applying Lean Manufacturing principles. The main goal was to identify and implement improvements to reduce waste, increase productivity, and enhance product quality. Through time-motion studies and value stream mapping, bottlenecks such as excessive waiting time and inadequate manual handling were identified. The proposed solution involved automating functional tests (FCT) with the development of a new JIG, leading to significant gains: a 12% increase in production capacity, elimination of 14 workstations, and improved quality, with the FPY (First Pass Yield) index reaching 98%.