ESTUDO DO PROCESSO DE SOLDAGEM DE CONECTORES HDMI EM PLACAS DE NOTEBOOK

Abstract

Derived from broader studies on improvements in the manufacturing processes of electronic products and computer hardware, this research aims to technically evaluate the weldability quality of the HDMI connector in the soldering process of Printed Circuit Boards (PCB) in notebooks. The study seeks to meet international acceptability criteria related to the solder fill of terminal components using Pin Through-Hole (PTH) technology, as specified in the IPC-A-610D standard. For the development of this research, the PDCA (Plan, Do, Check, Action) method was adopted, commonly used as a tool for problem-solving and continuous improvement in various industrial sectors. The analysis using X-ray inspection and metallographic cross-section tests demonstrated that the HDMI connector soldering process using reflow soldering showed better quality than manual soldering, ensuring product reliability. Based on the results achieved, the company in this study replaced manual soldering with SMT technology, employing the Pin in Paste (PIP) and reflow soldering processes.