Study of Quality and Reliability of Welding Process Reflow Component Technology BGA
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INSTITUTO DE TECNOLOGIA
Abstract
This study analyzed the quality and reliability of the BGA component Reflow soldering process in notebook motherboard manufacturing. Using a qualitative-quantitative approach via case study methodology, cross-section and X-ray analyses were conducted to evaluate alignment, cracks, and voids. The findings confirmed compliance with international standards IPC-A-610E and IPC-7095B, indicating the process is reliable and cost-effective for industrial application.
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Keywords
Qualidade no processo, Soldagem Reflow, Componente BGA, Cross section, Confiabilidade
Citation
COSTA, Robson Marques; LEITE, Jandecy Cabral; VIEIRA, Antonio da Silva; LOPES, Raimundo Valdan Pereira; FUJIYAMA, Roberto Tetsuo. Study of Quality and Reliability of Welding Process Reflow Component Technology BGA. ITEGAM - JETIA, v. 1, n. 1, p. 35-40, mar. 2015. ISSN 2447-0228. Disponível em: http://www.itegam-jetia.org.