Uso da Ferramenta OEE para Otimizar o Processo de Fabricação de Placas de Circuito Impresso no Processo SMT

Abstract

This dissertation addresses the application of the Overall Equipment Effectiveness (OEE) metric in the Surface Mount Technology (SMT) process to optimize production efficiency in a company located in the Manaus Industrial Hub. The study identifies the main losses affecting the printed circuit board assembly line, classifies these losses, and proposes improvement actions based on the Total Productive Maintenance (TPM) methodology. The methodology includes a case study, data collection from production lines, expert interviews, and practical application of performance indicators. The results demonstrate that the use of the OEE tool, combined with corrective and preventive measures, can enhance SMT line efficiency and significantly reduce losses related to downtime, speed, and quality.