Documentação de convênios

URI permanente desta comunidadehttps://rigalileo.itegam.org.br/handle/123456789/173

Trabalhos ténico-científico oriundos de convênios com universidades para oferta de turmas de mestrado e doutorados no Estado do Amazonas

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20152

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Autor: search.filters.author.COSTA, Robson MarquesAssunto: search.filters.subject.Engenharia Elétrica

Resultados da Pesquisa

Agora exibindo 1 - 2 de 2
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    Study of Quality and Reliability of Welding Process Reflow Component Technology BGA
    (INSTITUTO DE TECNOLOGIA, 2015) COSTA, Robson Marques; LEITE, Jandecy Cabral; VIEIRA, Antonio da Silva; LOPES, Raimundo Valdan Pereira; FUJIYAMA, Roberto Tetsuo; Prof. Dr. Carlos Tavares da Costa Júnior
    This study analyzed the quality and reliability of the BGA component Reflow soldering process in notebook motherboard manufacturing. Using a qualitative-quantitative approach via case study methodology, cross-section and X-ray analyses were conducted to evaluate alignment, cracks, and voids. The findings confirmed compliance with international standards IPC-A-610E and IPC-7095B, indicating the process is reliable and cost-effective for industrial application.
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    Análise da qualidade da soldagem do componente conector HDMI Mother Board Laptop
    (INSTITUTO DE TECNOLOGIA, 2015) VIEIRA, Antônio da Silva; COSTA, Robson Marques; FONSECA, Cristiano Mourão; FREITAS, Carlos Alberto de Oliveira; FUJIYAMA, Roberto Tetsuo; MAGALHÃES, Edilson Marques
    This paper assessed the quality of HDMI connector component welding in laptop printed circuit boards (PCBs) based on IPC-A-610D standards. The study applied the PDCA method to identify and resolve issues related to insufficient solder barrel filling. Through X-ray analysis and metallographic tests, it was demonstrated that the automated reflow soldering process (SMT) meets normative requirements, effectively replacing the manual process.