Documentação de convênios
URI permanente desta comunidadehttps://rigalileo.itegam.org.br/handle/123456789/173
Trabalhos ténico-científico oriundos de convênios com universidades para oferta de turmas de mestrado e doutorados no Estado do Amazonas
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3 resultados
Resultados da Pesquisa
Item Study of Quality and Reliability of Welding Process Reflow Component Technology BGA(INSTITUTO DE TECNOLOGIA, 2015) COSTA, Robson Marques; LEITE, Jandecy Cabral; VIEIRA, Antonio da Silva; LOPES, Raimundo Valdan Pereira; FUJIYAMA, Roberto Tetsuo; Prof. Dr. Carlos Tavares da Costa JúniorThis study analyzed the quality and reliability of the BGA component Reflow soldering process in notebook motherboard manufacturing. Using a qualitative-quantitative approach via case study methodology, cross-section and X-ray analyses were conducted to evaluate alignment, cracks, and voids. The findings confirmed compliance with international standards IPC-A-610E and IPC-7095B, indicating the process is reliable and cost-effective for industrial application.Item Análise da qualidade da soldagem do componente conector HDMI Mother Board Laptop(INSTITUTO DE TECNOLOGIA, 2015) VIEIRA, Antônio da Silva; COSTA, Robson Marques; FONSECA, Cristiano Mourão; FREITAS, Carlos Alberto de Oliveira; FUJIYAMA, Roberto Tetsuo; MAGALHÃES, Edilson MarquesThis paper assessed the quality of HDMI connector component welding in laptop printed circuit boards (PCBs) based on IPC-A-610D standards. The study applied the PDCA method to identify and resolve issues related to insufficient solder barrel filling. Through X-ray analysis and metallographic tests, it was demonstrated that the automated reflow soldering process (SMT) meets normative requirements, effectively replacing the manual process.Item Controle de Qualidade no Processo de Soldagem de Componentes BGA no Processo de Fabricação de Placas de Notebook(Universidade Federal do Pará, 2014) COSTA, Robson Marques; FUJIYAMA, Roberto TetsuoIn recent years, companies have invested in technological improvements to add lightweight, reduced size, and high performance to products, aiming to meet global demand. This dissertation aims to conduct a study on the quality and reliability of the Reflow soldering process of BGA (Ball Grid Array) technology components in the manufacturing of notebook boards. Using qualitative and quantitative methods, tests such as Cross Section and Dye and Pry were conducted to evaluate the soldering quality. The results showed that the Reflow soldering process meets the acceptability criteria of international standards, indicating that the process quality can reflect better cost conditions and competitiveness for the investigated organization.