Documentação de convênios

URI permanente desta comunidadehttps://rigalileo.itegam.org.br/handle/123456789/173

Trabalhos ténico-científico oriundos de convênios com universidades para oferta de turmas de mestrado e doutorados no Estado do Amazonas

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Autor: search.filters.author.VIEIRA, Antonio da SilvaTem arquivos: Sim

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Agora exibindo 1 - 2 de 2
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    Estudo do Processo de Soldagem de Conectores HDMI em Placas de Notebook
    (Universidade Federal do Pará, 2014) VIEIRA, Antonio da Silva; FUJIYAMA, Roberto Tetsuo
    Derived from broader studies on improvements in electrical and electronic manufacturing processes and computer goods, this research aims to technically evaluate the quality of weldability of the HDMI connector in the soldering process of Printed Circuit Boards (PCB) of notebooks, aiming to meet international acceptability criteria related to solder keg filling for Pin Through-Hole (PTH) component terminals as specified in the IPC-A-610D standard. For the development of the research steps, the Plan, Do, Check, and Action (PDCA) method was adopted. The results obtained through X-ray analysis and metallographic cross-section testing demonstrated that the quality of the HDMI component soldering through the reflow process, instead of the manual soldering process (hand soldering), meets the international IPC-A-610D standard, ensuring product reliability. Based on the results achieved, the company under study stopped performing manual soldering for this type of component in all notebook products, switching to soldering through SMT technology using the Pin in Paste (PIP) and Reflow soldering processes.
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    ESTUDO DO PROCESSO DE SOLDAGEM DE CONECTORES HDMI EM PLACAS DE NOTEBOOK
    (Universidade Federal do Pará, 2014) VIEIRA, Antonio da Silva; FUJIYAMA, Roberto Tetsuo
    Derived from broader studies on improvements in the manufacturing processes of electronic products and computer hardware, this research aims to technically evaluate the weldability quality of the HDMI connector in the soldering process of Printed Circuit Boards (PCB) in notebooks. The study seeks to meet international acceptability criteria related to the solder fill of terminal components using Pin Through-Hole (PTH) technology, as specified in the IPC-A-610D standard. For the development of this research, the PDCA (Plan, Do, Check, Action) method was adopted, commonly used as a tool for problem-solving and continuous improvement in various industrial sectors. The analysis using X-ray inspection and metallographic cross-section tests demonstrated that the HDMI connector soldering process using reflow soldering showed better quality than manual soldering, ensuring product reliability. Based on the results achieved, the company in this study replaced manual soldering with SMT technology, employing the Pin in Paste (PIP) and reflow soldering processes.